DS3800HLIC1B1C GE

Parameters

• Input Type: 24V DC discrete (sourcing/sinking, configurable)

• Input Channels: 24 channels (higher density than HLIA’s 16)

• Input Voltage: 24V DC (nominal), 10–30V DC range

• Input Current: 5mA per channel (typical)

• Response Time: <0.4ms (B1 optimized, faster than A1’s <0.5ms)

• Hardware Latch: Yes – captures short-duration pulses (<1ms) with B1 improved timing accuracy

• Isolation: 2500V RMS optical isolation (channel-to-backplane)

• Power: +5V DC @ 0.9A, +24V DC @ 0.3A (field power)

• Filtering: Programmable input debounce filter with 50Hz/60Hz noise rejection (B1 feature)

• Coating: Conformal coating (suffix C) – medium-thickness acrylic with improved humidity and mild chemical resistance

• Temp Range: -10°C to +65°C (extended, enabled by C coating)

• Mounting: 6U VME Eurocard, single-slot

• Diagnostics: Enhanced onboard with per-channel LED status, open-wire detection, short-circuit protection, signal noise alert, and latch event logging (B1 feature)

Advantages & Features

• Higher channel density – 24 high-speed inputs on a single board, more than HLIA’s 16 channels

• Ultra-fast response (<0.4ms) – the fastest discrete input response, designed for the most critical protection logic

• Hardware latch capability – captures short-duration pulses with improved timing accuracy from B1 firmware

• B1 firmware offers improved filtering, 50/60Hz noise rejection, and enhanced diagnostics including latch event logging – a significant upgrade over A1

• Flexible input configuration – channels can be set as sourcing or sinking via jumpers

• C-grade coating provides moderate moisture and dust protection compared to B – suitable for indoor environments with occasional humidity

• Extended temperature range (-10°C to +65°C) offers more flexibility than B variant

• Front-panel LEDs for per-channel status, fault, open-wire detection, and signal noise alerts

• Compatible with Mark IV backplanes and some VIe systems (with adapter)

Application Cases

• Overspeed protection – ultra-fast magnetic pickup sensor inputs for turbine overspeed trip logic with multiple sensors in moderately humid environments

• Flame detection – high-speed UV/IR flame scanner signals for burner management across multiple zones with latch event logging

• Emergency trip systems (ETS) – critical discrete inputs for emergency shutdown logic with high channel count

• Turbine start-up sequencing – fast-response speed and position sensors

• Retrofit projects upgrading from A1 firmware for faster response, noise rejection, and improved diagnostics

Competitor Comparison

• vs. DS3800HLIC1A1B (A1/B variant): Faster response (<0.4ms vs. <0.5ms), B1 noise rejection, enhanced diagnostics, and C coating (vs. B) – significant upgrade

• vs. DS3800HLIA1A1B (A1/B variant): More input channels (24 vs. 16), faster response, B1 diagnostics, and C coating – major upgrade

• vs. DS3800HLIA1B1D (B1/D variant): HLIC1B1C offers more channels (24 vs. 16) but has C coating (vs. D) – choose based on channel density vs. coating level

• vs. DS3800HLEA1C1C (input-only high-speed): HLIC1B1C offers faster response (<0.4ms vs. <0.6ms), hardware latch capability, and higher channel density (24 vs. 16) – HLIC is for critical protection applications

• vs. DS3800HLCA (hybrid I/O): HLIC1B1C is input-only with faster response (<0.4ms vs. <1ms) and hardware latch – better for critical protection

• vs. DS3800HHRB1D1D (standard discrete I/O): HLIC1B1C offers significantly faster response (<0.4ms vs. 3ms) – critical for high-speed protection

• vs. ABB DSDI series: Similar high-speed discrete capability, but GE offers faster response, higher density, hardware latch, and C coating

• vs. Siemens 6ES7 series: Similar functionality, but GE offers faster response, higher channel density, B1 diagnostics, and hardware latch

• vs. Woodward 5437 modules: GE offers faster response, higher density, hardware latch, and C-grade coating

Selection Suggestions

• Critical: Confirm input type (sourcing vs. sinking) – jumper settings must match your field devices

• Critical: Verify response time requirement – HLIC1B1C’s <0.4ms is for the most critical protection

• Verify your backplane provides both +5V and +24V field power with sufficient current capacity (+24V @ 0.3A)

• Assess channel count – 24 channels cover larger monitoring applications with multiple high-speed sensors

• Evaluate if B1’s latch event logging and noise rejection are beneficial – particularly valuable for critical protection applications requiring post-event analysis

• Evaluate environmental conditions – C coating is suitable for moderate humidity and light chemical exposure; choose D/G/H for more demanding conditions

• Order mating front connector (p/n may vary – confirm with GE)

• For critical protection applications, purchase with a calibration certificate and 12-month warranty

Precautions

• Critical: Do not exceed 30V DC on input channels – overvoltage may damage the isolation circuits

• Critical: High-speed inputs (<0.4ms) are extremely sensitive to noise – use shielded twisted-pair cables, proper grounding, and dedicated field wiring to avoid false triggers; B1’s noise rejection helps but is not a substitute for good wiring practices

• Critical: Hardware latch capability requires proper configuration – ensure the latch settings match your application requirements to avoid missing pulses or false captures

• Ensure field power supply (+24V DC) is stable and within 10–30V DC range

• B1 firmware offers improved filtering – configure debounce settings correctly for your sensor type; for critical protection, very short debounce delays (or none) may be needed

• C coating provides moderate protection but is not suitable for direct salt spray, heavy chemical exposure, or continuous condensation – upgrade to D/G/H for those conditions

• Allow 30–45 minute warm-up before commissioning (C coating affects thermal equilibrium)

• Store in ESD-safe packaging – edge connector is static-sensitive

• Periodically verify input operation every 6 months (critical protection circuits require frequent testing)

• Do not hot-swap – Mark IV backplanes require power-off for insertion/removal

• If replacing multiple lower-density boards, verify wiring and pinout compatibility – HLIC may differ from HLIA in pin assignments

• C coating may make component-level repairs difficult – consider board replacement instead of repair