IS200VPROH2B GE

¥999.00

The GE IS200VPROH2B is a VMEbus RISC Processor Board manufactured by General Electric for the Mark VIe distributed control system (DCS). This model represents a higher-performance variant within the VPRO family, distinguished by the “H2” designation—typically indicating a faster processor, enhanced memory capacity, or expanded communication capabilities compared to the H1 series. The GE IS200VPROH2B is engineered for demanding turbine control applications requiring additional computational headroom for complex algorithms, such as advanced combustion dynamics modeling, multi-shaft coordination, or high-frequency data acquisition.

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Description

Detailed Technical Specifications

  • Processor: PowerPC 750GX running at 1.0 GHz (versus 700 MHz on H1B), with enhanced FPU and larger L2 cache.

  • Memory:

    • 512 MB ECC SDRAM (double the H1 series) for larger application code and data logging.

    • 128 MB NOR Flash (increased firmware storage capacity).

    • 1 MB non-volatile SRAM with battery backup.

  • Communications:

    • Dual 10/100/1000Base-T Ethernet (I/O Net + HMI), with improved TCP/IP offload engine.

    • One RS-232 console port.

    • Additional high-speed serial link (optional) for peer-to-peer turbine coordination.

  • Form Factor: 6U VME64x (160 × 233 mm).

  • Operating Temp: 0 °C to +60 °C (standard, non-coated).

  • Power Draw: 25 W typical (+5 V / +3.3 VDC).

  • Battery: BR2032 lithium coin cell.


Advantages & Distinctive Features

  • Higher Processing Power: The 1.0 GHz PowerPC GX core provides ~40% faster execution of complex control loops, enabling more sophisticated algorithms (e.g., model-predictive control, real-time emissions optimization) without increasing scan cycle time.

  • Expanded Memory: 512 MB SDRAM allows for larger application programs, extended trend logging (up to 30 days of 1-second data), and simultaneous execution of multiple C-coded function blocks.

  • Faster I/O Scanning: Maintains <1 ms deterministic scan via I/O Net, but with reduced CPU utilization—leaving more headroom for diagnostics and communication tasks.

  • Enhanced Redundancy: Hot-standby with <2 ms bumpless transfer, identical to H1B series.

  • Software Ecosystem: ControlST v6.5 or higher recommended to fully leverage the H2B’s processing capabilities; backward-compatible with v6.2 in reduced-performance mode.

  • Retrofit Compatibility: Direct replacement for H1 series boards (same backplane and connector pinout), but requires firmware update to utilize additional memory and speed.


Application Fields

  • Advanced Gas Turbines: Heavy-duty frames (9F, 7F, 9E) with dry low NOx (DLN) combustion systems requiring complex fuel-staging algorithms.

  • Combined-Cycle Optimization: Real-time heat-rate optimization and steam turbine coordination.

  • Compressor Stations: Anti-surge control with predictive modeling for variable-speed drives.

  • Wind Turbine Clusters: Coordinated control of multiple turbines in a wind farm (via peer-to-peer link).

  • Research & Development: Turbine test cells where high-speed data acquisition and algorithm prototyping are required.


Comparison with Competing Products

Feature GE IS200VPROH2B Competitor A (Siemens T-3000) Competitor B (Woodward MicroNet Plus)
Processor PowerPC GX @ 1.0 GHz Intel x86 @ 1.0 GHz PowerPC 604e @ 400 MHz
RAM 512 MB ECC 256 MB 128 MB
Flash 128 MB 64 MB 32 MB
Redundancy Hot-stby (<2 ms) Warm-stby (>50 ms) Hot-stby (5 ms)
I/O Scan <1 ms (I/O Net) 2–5 ms (Profinet) 1–2 ms (EtherCAT)
Retrofit Direct for H1 series Rack mod New backplane

The GE IS200VPROH2B offers the highest processing power and memory capacity in its class while maintaining direct retrofit compatibility with existing Mark VIe installations—a significant upgrade path advantage.


Selection Guidelines

  • When to choose: Upgrade from H1 series when application complexity exceeds 70% CPU utilization, or when implementing advanced algorithms (DLN optimization, predictive maintenance, high-frequency data logging).

  • Compatibility: VME64x backplane, power supply delivering +3.3 V @ ≥7 A (IS200EPSMG2 or higher). Direct swap for H1A/H1AC/H1B/H1BCB/H1BCC/H1BCD.

  • Firmware: Requires ControlST v6.5+ for full performance; v6.2 operates in H1 compatibility mode (limited to 700 MHz, 256 MB RAM).

  • Cooling: Higher power dissipation (25 W vs. 20 W)—ensure cabinet airflow ≥250 LFM.

  • Battery: Replace BR2032 if stored >12 months.


Operational Precautions

  1. Thermal Management: 25 W dissipation requires adequate cooling—monitor on-board temperature sensor via ControlST; derate ambient to 55 °C if airflow <250 LFM.

  2. Firmware Upgrade: After installation, flash the board with the correct H2B firmware image—do not run H1 firmware on H2B hardware as memory mapping differs.

  3. Application Porting: Recompile existing H1 applications under ControlST v6.5 to utilize the full 512 MB RAM and 1.0 GHz speed—legacy binaries will run but at reduced capability.

  4. ESD Handling: Standard precautions apply—handle by edges or extraction handle.

  5. Redundancy Testing: Validate switchover performance after upgrade—should match H1B performance (<2 ms).

  6. Spare Stock: Maintain 1:1 ratio for critical assets; H2B spares can replace H1 units (forward-compatible), but H1 spares cannot replace H2B without firmware limitations.

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