Description

GE IC698CHS017 – Compact PLC Chassis for GE RX3i Series

Product Description

Product Parameters

1. Chassis Type: Compact rack-mount PLC chassis, exclusive to GE RX3i Series PLC systems
2. Slot Capacity: 7 dedicated slots (1 CPU slot + 6 I/O/specialty module slots) for RX3i-compatible modules
3. Backplane Bandwidth: 1 Gbps full-duplex, enabling high-speed data exchange between connected modules with minimal latency
4. Power Distribution: Integrated 24 VDC power bus with overcurrent protection, supporting up to 15 A total load for connected modules
5. PLC Compatibility: Fully compatible with GE RX3i CPU modules (IC695CPU374, IC695CPU380), I/O modules (IC695HSC304, IC695MDL653), and communication modules (IC695ETM001-EJ)
6. Operating Temperature Range: -40°C to 70°C (-40°F to 158°F), resilient to extreme industrial temperature fluctuations
7. Physical Dimensions: 254 mm × 178 mm × 229 mm (10.0 in × 7.01 in × 9.02 in), 19-inch rack-mountable (EIA standard) for easy cabinet integration
8. Weight: 2.8 kg (6.17 lbs), lightweight for flexible installation in compact control enclosures
9. Certifications: UL 508, CE, IEC 61131-2, ATEX, and IEEE 1613 compliant, meeting global industrial safety and performance standards
10. Operating Humidity: 5% – 95% (non-condensing), adaptable to humid or moisture-prone industrial settings
11. Mechanical Protection: Corrosion-resistant steel chassis with IP20 dust protection rating, suitable for harsh factory environments
12. Backplane Type: Passive backplane with gold-plated connectors for enhanced signal integrity and long-term reliability

Advantages and Features

1. Space-Saving 7-Slot Design: The GE IC698CHS017’s compact 7-slot configuration maximizes I/O capacity within a small footprint, ideal for control cabinets with limited space in machine-level automation or decentralized control stations.
2. High-Speed Backplane Performance: 1 Gbps full-duplex backplane ensures low-latency signal transmission between CPU and I/O modules, making it suitable for time-sensitive applications like real-time process monitoring and motion control.
3. Reliable Power Distribution: Integrated overcurrent protection safeguards connected modules from voltage spikes and overloads, extending the lifespan of the entire PLC system and reducing unplanned downtime.
4. Industrial-Grade Durability: A wide operating temperature range, corrosion-resistant steel chassis, and gold-plated backplane connectors ensure the GE IC698CHS017 performs stably in harsh conditions, including high-vibration and dusty factory environments.
5. Seamless RX3i Ecosystem Integration: Plug-and-play compatibility with all RX3i modules eliminates integration issues, simplifying system design and reducing deployment time for engineers and technicians.
6. Cost-Effective Flexibility: The balanced slot capacity (6 I/O slots) caters to small-to-mid-scale applications without the cost or space requirements of larger 10-slot or 16-slot chassis, optimizing hardware investment.

Application Cases in Application Fields

1. Machine Tool Control: A precision machining company deployed the GE IC698CHS017 in its CNC lathe control systems, using the 7-slot chassis to integrate a CPU module, high-speed counter module, and analog I/O module. The compact size fit into the lathe’s built-in control cabinet, while the high-speed backplane ensured real-time adjustment of cutting parameters, improving machining accuracy by 22%.
2. Small-Batch Manufacturing Cell: A specialty electronics manufacturer integrated the GE IC698CHS017 into its printed circuit board (PCB) assembly cell, housing a CPU module, digital I/O modules, and an Ethernet communication module in the 7-slot chassis. The decentralized control setup streamlined production for small batches, reducing changeover time by 30% compared to centralized PLC systems.
3. Remote Water Pump Monitoring: A municipal water utility used the GE IC698CHS017 in its remote pump station control systems, leveraging the chassis to connect a CPU module, pressure sensor input module, and wireless communication module. The compact design and rugged construction withstood outdoor temperature fluctuations, ensuring 24/7 monitoring of pump performance and reducing emergency maintenance calls by 25%.
4. Packaging Machine Automation: A consumer goods manufacturer adopted the GE IC698CHS017 for its standalone packaging machines, using the 7-slot chassis to integrate a CPU module, digital output module, and barcode scanner interface module. The plug-and-play compatibility with RX3i modules simplified machine assembly and maintenance, cutting production line downtime by 18%.

Comparisons with Competing Products

Selection Suggestions and Precautions

Selection Suggestions

1. Align with RX3i Ecosystem: Prioritize the GE IC698CHS017 if your system uses GE RX3i modules, as it ensures full compatibility and optimal performance without the need for adapter hardware.
2. Assess Space and Scale Needs: Choose this chassis for small-to-mid-scale applications (e.g., machine-level control, small manufacturing cells) requiring 4-6 I/O modules, as it balances slot capacity and space efficiency.
3. Evaluate Environmental Conditions: Opt for the GE IC698CHS017 for harsh industrial settings (e.g., outdoor pump stations, high-vibration factories) due to its wider operating temperature range and rugged steel chassis.
4. Compact Control Cabinet Requirements: Select this module if you need a 19-inch rack-mount chassis for standard control cabinets, as its EIA-compliant design ensures seamless integration without custom modifications.

Precautions

1. Module Insertion: Insert and remove modules gently to avoid bending backplane pins; always power off the chassis before adding or replacing non-hot-swappable modules to prevent electrical damage.
2. Power Supply Matching: Use only GE-recommended 24 VDC power supplies to ensure compatibility with the chassis’s power bus and avoid overloading or voltage instability.
3. Static Protection: Use anti-static wristbands when handling the GE IC698CHS017 and connected modules, as electrostatic discharge can damage sensitive backplane circuitry and module components.
4. Ventilation and Cooling: Ensure adequate airflow around the chassis (minimum 15 mm clearance on all sides) to prevent overheating, especially when the chassis is fully populated with high-power modules.
5. Connector Maintenance: Periodically inspect the backplane’s gold-plated connectors for dust, corrosion, or wear; clean with a dry, lint-free cloth to maintain optimal signal integrity and module connectivity.

IC698CHS017