GE IC695PBM300

¥999.00

Product Parameters

Parameter Category Specifications
Brand & Model GE IC695PBM300
Product Type Backplane Memory Module for GE RX3i Series PLC
Memory Architecture Dual-memory design (program storage + data logging partition)
Total Memory Capacity 32 GB industrial-grade non-volatile flash memory
Program Storage Partition 16 GB (for PLC logic, firmware, and configuration files)
Data Logging Partition 16 GB (for real-time sensor data, event logs, and process records)
Data Transfer Speed 150 MB/s read; 100 MB/s write
Communication Interface Integrated backplane interface (direct connection to RX3i CPU)
Operating Temperature -40°C to 75°C
Storage Temperature -55°C to 85°C
Power Consumption 2.5 W typical (24 VDC input)
Input Voltage 24 VDC (18-36 VDC input range)
Compatibility Fully compatible with all GE RX3i CPU modules and control racks (IC695CRU320, IC695CRU320-EZ)
Form Factor Rack-mounted (single-slot design for RX3i 3U rack units)
Dimensions (W x H x D) 44 mm x 132 mm x 312 mm
Certifications UL 508, CE, ATEX, IEC 61131-2, ISO 9001, RoHS compliant
Weight 0.5 kg
Category:

Description

GE IC695PBM300 – High-Capacity Backplane Memory Module for RX3i PLC

Product Description

The GE IC695PBM300 is a high-performance backplane memory module exclusively designed for GE’s RX3i series PLC systems, engineered to expand storage capacity and enhance data processing efficiency for complex industrial automation applications. As a critical storage component in GE’s industrial control ecosystem, the GE IC695PBM300 integrates large-capacity non-volatile memory with fast data read/write speeds, providing ample space for large PLC programs, historical data logs, and firmware backups. What sets the GE IC695PBM300 apart is its dual-memory architecture, which separates program storage and data logging to prevent performance bottlenecks during high-intensity operations. The GE IC695PBM300 features plug-and-play compatibility with all RX3i CPU modules and control racks, eliminating complex configuration and enabling quick upgrades for existing systems. Whether deployed in large-scale manufacturing plants, energy management facilities, or multi-process industrial complexes, the GE IC695PBM300 delivers reliable, high-capacity memory support that is essential for uninterrupted 24/7 industrial operations.

Product Parameters

Parameter Category Specifications
Brand & Model GE IC695PBM300
Product Type Backplane Memory Module for GE RX3i Series PLC
Memory Architecture Dual-memory design (program storage + data logging partition)
Total Memory Capacity 32 GB industrial-grade non-volatile flash memory
Program Storage Partition 16 GB (for PLC logic, firmware, and configuration files)
Data Logging Partition 16 GB (for real-time sensor data, event logs, and process records)
Data Transfer Speed 150 MB/s read; 100 MB/s write
Communication Interface Integrated backplane interface (direct connection to RX3i CPU)
Operating Temperature -40°C to 75°C
Storage Temperature -55°C to 85°C
Power Consumption 2.5 W typical (24 VDC input)
Input Voltage 24 VDC (18-36 VDC input range)
Compatibility Fully compatible with all GE RX3i CPU modules and control racks (IC695CRU320, IC695CRU320-EZ)
Form Factor Rack-mounted (single-slot design for RX3i 3U rack units)
Dimensions (W x H x D) 44 mm x 132 mm x 312 mm
Certifications UL 508, CE, ATEX, IEC 61131-2, ISO 9001, RoHS compliant
Weight 0.5 kg

Advantages and Features

  1. Large Dual-Partition Memory: The GE IC695PBM300 offers 32 GB total capacity split into 16 GB program storage and 16 GB data logging partitions, eliminating storage conflicts and ensuring smooth performance even when running large PLC programs and logging high-volume real-time data simultaneously.
  2. High-Speed Data Transfer: With 150 MB/s read and 100 MB/s write speeds, the module enables fast loading of complex control logic and quick retrieval of historical data, reducing downtime during program updates and troubleshooting.
  3. Seamless RX3i Ecosystem Integration: Designed for plug-and-play compatibility with all RX3i hardware, the GE IC695PBM300 requires no custom firmware or adapter modules, allowing engineers to complete installation in minutes and minimizing configuration errors.
  4. Industrial-Grade Reliability: Built with rugged non-volatile flash memory that retains data even during power outages, the module withstands extreme temperatures (-40°C to 75°C) and electromagnetic interference (EMI), making it suitable for harsh environments like steel mills and outdoor utility stations.
  5. Data Integrity Protection: Features built-in error correction code (ECC) technology to detect and fix data corruption, ensuring the accuracy of critical PLC programs and process logs for compliance and quality control.
  6. Simplified Maintenance: Supports remote memory management via GE’s CIMPLICITY software, allowing engineers to back up programs, export data logs, and update firmware without on-site intervention, reducing maintenance costs.

Application Cases in Application Fields

  1. Automotive Mass Production Line: A global automotive OEM deployed the GE IC695PBM300 in its assembly line PLCs to store complex robotic control programs and log real-time production data. The dual-partition memory prevented program delays during high-volume logging, while the large capacity supported 6 months of continuous data storage without manual export.
  2. Renewable Energy (Wind Farm): A wind energy company integrated the GE IC695PBM300 into its turbine control PLCs to store performance algorithms and log wind speed, power output, and component health data. The module’s rugged design withstood extreme outdoor temperatures, and the high-speed transfer enabled quick analysis of turbine efficiency data.
  3. Chemical Batch Processing: A chemical manufacturer used the GE IC695PBM300 to support its batch production line PLCs, where detailed logging of temperature, pressure, and ingredient mixing data is required for regulatory compliance. The 16 GB data logging partition stored 1 year of batch records, simplifying audits and quality traceability.
  4. Semiconductor Fabrication: A semiconductor OEM deployed the GE IC695PBM300 in its cleanroom PLCs to store precision machining programs and log wafer production data. The data integrity protection feature ensured no corruption of sensitive process parameters, while the large program storage supported complex multi-step fabrication logic.

Comparisons with Competing Products

Feature GE IC695PBM300 Competitor A (Brand X MEM-BP200) Competitor B (Brand Z BACK-300)
Total Memory Capacity 32 GB (dual-partition) 16 GB (single partition) 24 GB (single partition)
Data Transfer Speed 150 MB/s read; 100 MB/s write 100 MB/s read; 60 MB/s write 120 MB/s read; 80 MB/s write
Data Protection Built-in ECC technology No ECC support Basic error detection only
Operating Temperature -40°C to 75°C -25°C to 65°C -30°C to 70°C
RX3i Compatibility Full native compatibility Requires adapter module Partial compatibility (limited CPUs)
Power Consumption 2.5 W 3.8 W 3.2 W
The GE IC695PBM300 outperforms competitors with its larger dual-partition memory, faster data transfer speeds, and built-in ECC protection—features that are critical for complex industrial applications. Its full RX3i native compatibility and wider operating temperature range also make it a more reliable and cost-effective choice than competitors that require extra adapters or struggle in harsh environments.

Selection Suggestions and Precautions

  1. Selection Suggestions:
    • Choose the GE IC695PBM300 for RX3i PLC systems running large control programs, logging high-volume real-time data, or operating in regulated industries (chemical, pharmaceutical, automotive) where long-term data storage and integrity are essential.
    • Opt for this module if your application requires remote memory management, as it supports seamless integration with GE’s industrial software for off-site backups and data analysis.
    • Prioritize the GE IC695PBM300 for harsh environment deployments, thanks to its rugged design and wide temperature tolerance (-40°C to 75°C) that outperforms most competing backplane memory modules.
  2. Precautions:
    • Ensure the module is installed in a GE RX3i 3U rack unit and paired with compatible RX3i CPU modules to avoid memory interface errors.
    • Verify the input voltage stays within the 18-36 VDC range to protect the module’s internal memory components from damage.
    • Regularly back up the program and data partitions via GE software to prevent data loss in the rare event of memory failure.
    • Avoid exposing the module to direct moisture or corrosive gases, even with industrial-grade protection, to preserve the longevity of the flash memory chips.
    • Do not exceed the maximum write cycles of the flash memory (rated for 100,000 cycles) by unnecessarily overwriting large data files frequently.

IC695PBM300

A6500-RC
64711245C
BAI20-320
PSMU-350-3
3AFE61320946P0001
CB06560
DS2020FECNRX010A

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