GE DS3800XAIB1C1C

¥999.00

The DS3800XAIB1C1C is a high-density, high-reliability variant of the GE Mark IV analog I/O extender board. It provides 32 analog inputs and 16 analog outputs, offering maximum I/O density for large turbine control systems. This variant features enhanced input filtering, improved isolation, wider temperature range, and updated firmware (1C1C) for superior performance in demanding environments. It works alongside boards such as the DS3800NVIA1G1CDS3800NVIA1G1DDS3800NVPA series, and DS3800NVOC to provide comprehensive analog signal handling.

Category:

Description

Key Parameters

  • Analog Input Channels: 32 differential or 64 single-ended (software-configurable)

  • Analog Input Types: 0–10V, ±10V, 4–20mA (jumper-selectable per bank of 8)

  • Analog Output Channels: 16 independent (0–10V, ±10V, or 4–20mA)

  • Resolution: 16-bit ADC (inputs – improved), 12-bit DAC (outputs)

  • Accuracy: ±0.05% of full scale (inputs), ±0.15% of full scale (outputs)

  • Isolation: 1500V RMS channel-to-backplane (enhanced)

  • Diagnostics: LED status per bank, over-range/under-range detection, open-circuit detection, output fault detection

  • EMI/RFI Filtering: Enhanced input filters for superior noise rejection

  • Temp Range: –40°C to +85°C (extended)

  • Power Supply: +5V, ±15V from VME backplane (higher current draw)

  • Physical: 6U VME single-slot board

  • Key Variant Features: 16-bit ADC, 32 inputs / 16 outputs, enhanced isolation, extended temp range, conformal coating, updated firmware (1C1C)


Advantages

  • Maximum I/O density – provides 32 analog inputs and 16 analog outputs on a single board, replacing two standard boards and saving valuable rack slots.

  • High precision – 16-bit ADC resolution (vs. 14-bit on standard DS3800XAIB) provides superior measurement accuracy for critical parameters.

  • Enhanced noise immunity – upgraded input filters reject high-frequency interference, ideal for environments with VFDs or large switchgear.

  • Extended temperature range – operates reliably from –40°C to +85°C, suitable for harsh outdoor or unheated cabinet installations.

  • Bank configuration – inputs grouped into banks of 8, each configurable for voltage or current, simplifying large system setup.

  • Conformal coating – protects the PCB against moisture, salt spray, and airborne contaminants for offshore or chemical plant applications.

  • Combined I/O – integrates both input and output capability, reducing overall board count.


Applications

  • Combined-cycle power plants – monitors multiple gas turbines, HRSGs, and steam turbines from a single rack.

  • Large gas turbines (Frame 9 and above) – provides inputs for multiple exhaust thermocouple zones, fuel flow meters, and compressor discharge sensors.

  • Offshore platforms – the General Electric DS3800XAIB1C1C is specifically suited for saltwater environments requiring extended temperature and corrosion resistance.

  • Harsh industrial environments – chemical plants, desert installations, and pulp & paper mills benefit from the ruggedized design.

  • Retrofits – adds significant I/O capacity to legacy Mark IV systems without cabinet modifications.


vs Competitors & Previous Variants

Feature DS3800XAIB1C1C Standard DS3800XAIB Standard DS3800XAIA Generic VME Board
Analog inputs 32 diff / 64 SE 32 diff / 64 SE 16 diff / 32 SE 8–16 diff
Analog outputs 16 16 8 2–4
Input resolution 16-bit 14-bit 14-bit 12–14-bit
Output resolution 12-bit 12-bit 12-bit 12-bit
Isolation 1500V 1000V 1000V 500–1000V
EMI/RFI filtering Enhanced Standard Standard Typically none
Temp range –40°C to +85°C –30°C to +70°C –30°C to +70°C 0°C to +60°C
Conformal coating Yes Optional Optional Rarely
Firmware revision 1C1C Varies Varies N/A

Selection Tips

  • Harsh environments – choose the DS3800XAIB1C1C for offshore, desert, or chemically aggressive sites where temperature extremes and corrosion are concerns.

  • High precision needs – select this variant over standard DS3800XAIB for applications requiring 16-bit accuracy (e.g., critical temperature averaging or flow calculations).

  • Power budget verification – the DS3800XAIB1C1C draws higher current than standard boards. Verify power supply capacity before installing multiple units.

  • Channel planning – map sensors and actuators to the 32 inputs and 16 outputs; group similar signal types into banks of 8 for simpler configuration.

  • Heat dissipation – due to high component density, ensure cabinet cooling >250 CFM if multiple high-density boards are installed.

  • Spare strategy – keep one General Electric DS3800XAIB1C1C per 8 installed units; its critical role in large installations warrants ready availability.

  • Calibration – perform spot-check calibration on representative channels after installation, as bank-wide configuration affects all channels in that group.


Critical Precautions

  • Power supply loading – do not exceed backplane power ratings when installing multiple DS3800XAIB1C1C boards; monitor voltage levels at test points during commissioning.

  • Over-voltage on inputs – never apply voltage above ±30V to any analog input; this can damage the 16-bit ADC front-end circuitry.

  • Output short circuit – do not short outputs to ground or positive supply; the DS3800XAIB1C1C has limited current protection.

  • Ground loops – use single-point grounding for field transmitters to avoid common-mode voltage exceeding ±10V on inputs.

  • Wiring separation – keep analog signal wiring away from AC power lines and high-voltage cables to prevent noise coupling.

  • Bank grouping – ensure all channels within each 8-channel bank are set to the same input type (voltage or current); mismatched settings can cause crosstalk.

  • Calibration intervals – schedule verification every 6–12 months to maintain ±0.05% accuracy, especially for critical 4–20mA loops.

  • ESD handling – always use a grounded wrist strap; the high-density design has many exposed components and is ESD-sensitive.

  • Humidity – avoid condensation; conformal coating protects against moisture, but high humidity can still affect connector contacts.

  • Hot-swap – never insert or remove the DS3800XAIB1C1C while the rack is powered; high current draw increases the risk of arcing and damage.

SIEMENS 6ES7590-1AB60-0AA0
A-B 1756-TBCH
SCHNEIDER 140XTS00200

Reviews

There are no reviews yet.

Be the first to review “GE DS3800XAIB1C1C”

Your email address will not be published. Required fields are marked *

Post comment