ABB 5SHY35L4512

Description

The ABB 5SHY35L4512 is a high-power Insulated-Gate Bipolar Transistor (IGBT) power semiconductor module, a core component within ABB’s renowned HiPak IGBT press-pack family. It is not a PLC spare part in the traditional sense, but a critical power electronic device used to build high-power converters and inverters, which are essential for motor drives, industrial power supplies, and renewable energy systems often controlled by PLCs and automation systems.

Product Description

The ABB 5SHY35L4512 is a robust, high-current IGBT module designed for demanding medium-voltage and high-power applications. Its primary function is to act as a high-speed electronic switch, rapidly turning on and off to control the flow of electrical power in converter circuits. Integrating the ABB 5SHY35L4512 into a power stack enables the creation of variable frequency drives (VFDs) for large motors, active front ends for grid connection, and inverters for high-power applications. This module’s design is centered on reliability, low inductance, and efficient heat dissipation. For drive engineers and power electronics specialists, the ABB 5SHY35L4512 represents a building block for constructing megawatt-scale power control systems. Its press-pack technology eliminates bond wires and uses a spring pressure contact system, enhancing its power cycling and thermal cycling capabilities. The performance and durability of the ABB 5SHY35L4512 are critical for the uptime of major industrial processes.

Product Parameters

• Manufacturer: ABB Semiconductors.

• Product Family: HiPak IGBT Module (Press-Pack).

• Model: 5SHY35L4512.

• Type: Dual IGBT with anti-parallel diode (common configuration).

• Voltage Class: 3300V.

• Current Rating: Typically 1200A or 1600A (specific to this variant; exact rating must be verified from datasheet).

• Package: HiPak (Press-Pack) module, requiring external clamping mechanism and heatsink for cooling.

• Technology: IGBT (Insulated-Gate Bipolar Transistor).

• Key Features: Low Vce(sat), short-circuit withstand capability, and industry-standard footprint.

Advantages and Features

• High Power Density: Capable of handling very high voltage and current in a single module, reducing the complexity and size of power stacks.

• Press-Pack Reliability: The solder-less, pressure-contact design provides superior thermal cycling and power cycling performance compared to conventional wire-bonded modules, leading to longer service life in demanding applications.

• Low Stray Inductance: The module’s internal design minimizes parasitic inductance, which is crucial for reducing voltage spikes during switching and enabling higher frequency operation.

• Parallelability: Designed to be easily paralleled with other identical modules to achieve even higher current ratings in modular converter designs.

• Proven Field Performance: The ABB HiPak platform, including modules like the ABB 5SHY35L4512, has a long and proven track record in heavy industry, rail traction, and energy applications.

Application Cases in Industry

• Industrial High-Power Drives: The core switching element in medium-voltage VFDs (Variable Frequency Drives) for controlling fans, pumps, compressors, and rolling mills in mining, metals, and cement industries.

• Rail Traction: Used in the main propulsion inverters for locomotives and high-speed trains.

• Renewable Energy: A key component in the power conversion stages of large wind turbine generators and solar inverters for grid connection.

• Power Transmission (HVDC & FACTS): Employed in Voltage Source Converter (VSC) stations for HVDC transmission and Static Synchronous Compensators (STATCOMs) for grid stabilization.

Comparison with Competing Products

Competing high-power IGBT modules come from manufacturers like Infineon (PrimePACK), Mitsubishi Electric (CM/LV series), and Hitachi. The ABB 5SHY35L4512, with its press-pack (HiPak) technology, is often compared to Infineon’s PrimePACK or Mitsubishi’s HVIGBT modules. The primary advantage of the ABB press-pack design is its inherent robustness under thermal stress, offering potentially higher reliability in applications with frequent load cycles. Compared to standard modules, it requires a more sophisticated mechanical clamping system but eliminates failure modes related to solder fatigue and bond wire lift-off.

Selection Suggestions and Precautions

1. Exact Replacement Verification: This part number is highly specific. It is crucial to match the model ABB 5SHY35L4512 exactly from the failed component’s label or the original drive’s bill of materials. Even minor suffix changes can indicate different voltages or current ratings.

2. System Compatibility Check: The module must be compatible with the existing gate driver unit, clamping mechanism, heatsink, and busbar assembly in the drive or converter cabinet.

3. Professional Installation Required: Replacement of a HiPak module is a complex procedure. It requires specialized tools, proper cleaning, application of thermal interface material, and precise control of the clamping force according to ABB’s technical manuals. Incorrect installation will lead to immediate failure.

4. Gate Driver & Protection: Always verify and test the associated gate driver board. An IGBT failure is often caused by a faulty driver. Ensure all protective circuits (short-circuit, overcurrent, de-sat protection) are functional.

5. Source from Authorized Distributors: Given its high cost and critical role, always source the ABB 5SHY35L4512 from ABB or its authorized semiconductor distributors to guarantee authenticity, correct specifications, and to receive the necessary technical documentation for installation.

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